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Tohoku University Technology: Method for Fabricating Wiring with Sub-Micrometer Line Width: T11-050

It is possible to create metal wiring patterns that are finer than the width of the type!

Nanoimprint lithography, consisting of two processes: the molding of resist materials and lithography, is gaining attention as a method for producing fine patterns suitable for medium-scale production. On the other hand, when precisely fabricating patterns on the scale of visible light wavelengths, there is a problem of increased costs due to the necessity of using electron beam lithography equipment for mold manufacturing. The present invention relates to a method for fabricating finer submicron-width metal wiring on a substrate using a mold with micro line widths that can be easily obtained through laser drawing, combined with inexpensive aqueous wet etching. By using a mold with a line width of 2 μm, submicron-width metal wiring on the scale of infrared and visible light wavelengths can be produced through aqueous side etching, which is expected to reduce mold costs and allows for the production of metal wiring (gold, silver, copper, chromium) with different line widths from the same mold.

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